The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...

With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements Hsinchu, Taiwan -- April 14, 2008 –Global ...

The SiP Flow help designers ensure component design success with accurate and systematic analysis of inter-die and package effects Hsinchu, Taiwan -- July. 27, 2009 --Global Unichip Corp. (GUC; TW: ...