Here is a close look at the common- versus differential-mode voltage and instrumentation amplifier (IA) topologies.

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

Abstract: Accurate and efficient identification of reliability-critical paths (RCPs) not only facilitates fault localization and troubleshooting but also allows circuit designers to improve circuit ...

Abstract: Although two-dimensional (2D)-materials (2DM) with a wide range of spin orbit coupling (SOC), and exotic structural and electrical properties, are very attractive for designing both ...